物理学进展 ›› 2018, Vol. 38 ›› Issue (2): 69-81.
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董岚,张颖,徐象繁
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摘要: 高分子聚合物基热界面材料对高密度集成电路的散热起到至关重要的作用。本文主要阐述 高分子聚合物热导率的理论及实验研究进展,重点介绍近年来关于调控高分子聚合物热导率的相 关工作。此外,本文还对高分子聚合物热输运调控的发展趋势进行了展望,讨论目前研究中尚未 解决的问题及瓶颈。
关键词: 高分子聚合物;聚合物基热界面材料;高热导率;聚合物复合材料
Abstract: Polymer-based thermal interface materials play an important role in the heat removal and thermal management of high-density integrated circuits. Here, we introduce the theoretical and experi- mental progress of the thermal conductivity of polymers. Main foci are given to enhancement of thermal conductivity in polymers, including stretched polymer and polymer-based nanocompos- ites. Bottlenecks and challenges in this eld are also comprehensive discussed in this review.
Key words: polymer; polymer-based thermal interface materials; high thermal conductivity; polymer nanocomposites
董岚,张颖,徐象繁. 高分子聚合物热输运调控的研究进展[J]. 物理学进展, 2018, 38(2): 69-81.
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https://pip.nju.edu.cn/CN/Y2018/V38/I2/69