Progress in Physics ›› 2018, Vol. 38 ›› Issue (2): 69-81.
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Abstract: Polymer-based thermal interface materials play an important role in the heat removal and thermal management of high-density integrated circuits. Here, we introduce the theoretical and experi- mental progress of the thermal conductivity of polymers. Main foci are given to enhancement of thermal conductivity in polymers, including stretched polymer and polymer-based nanocompos- ites. Bottlenecks and challenges in this eld are also comprehensive discussed in this review.
Key words: polymer; polymer-based thermal interface materials; high thermal conductivity; polymer nanocomposites
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URL: https://pip.nju.edu.cn/EN/
https://pip.nju.edu.cn/EN/Y2018/V38/I2/69